Applicable to all types of display screen of the thermocompression bonding process (TP capacitive screen, pressing a conductive film, the flexible circuit board, ITO conductive glass, etc.), which advances in the bottom surface of the thermal head, and have a buffering effect on the temperature, so thattemperature is more uniform, isolated by hot pressing products in direct contact with a thermal head, while isolation prevent static electricity leakage protection role. Thermal conductivity of the insulating semiconductor.